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BARCs Bottom antireflective coatings (BARCs) are organic-based materials that eliminate reflective notchings and significantly reduce line width variations caused by photoresist film thickness changes over topography on a wafer. This product is offered for i-line, deep-UV, and 193-nm technologies.     CMP-slurries We develop, manufacture and market chemical mechanical polishing (CMP) slurries. These slurry materials are used in polishing wafers, a necessary step in providing a smooth surface for the following layer of circuitry in the manufacture of chips. In addition to providing CMP slurries for the mainstay silicon and aluminum wafer markets, We have expertise in the new copper slurry technology.   Developers We provide a wide range of developers to develop the exposed photoresist pattern, to semiconductor and flat panel display manufacturing markets.     Poto resists Photoresists are chemicals used in creating circuit patterns on chips. Our photoresists range from its conventional g-line and i-line used in mainstream devices to advanced i-line, deep UV and 193 nm.   Thinners,Strippers Dongjin's thinners and strippers for photoresists provide processing choices and performance advantages over current industry standards. Thinner products provide world-class edge bead removal while complying with industry standards for purity, packaging and environmental protection. Thinners and strippers are used to remove excess photoresists and residues after the etching stage of substate.         PRODUCT TOPへ