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BARCsbCMPbdeveloperbphotoresistbstrippers
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Photoresists are chemicals
used in creating circuit patterns on chips. Our photoresists range
from its conventional g-line and i-line used in mainstream devices
to advanced i-line, deep UV and 193 nm.
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Photoresist of semiconductor
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| No |
Product Name |
Characteristic |
Performance |
Thk
( ) |
Eop
(msec) |
Resolution
() |
| |
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180 |
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| 1 |
DSAM-300 |
g-line
Normal Grade |
1.23 |
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0.6 |
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0.8 |
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gi-line Compatible High |
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128 |
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| 2 |
DPR-i5500 |
Sensitivity Ractangular |
1.17 |
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0.4 |
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0.6 |
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Profile |
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High Sensitivity |
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132 |
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| 3 |
DS-i1000 |
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1.7 |
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0.6 |
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Ractangular Profile |
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0.8 |
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534 |
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| 4 |
DPR-i7000 |
High Resolution & Contrast |
1.0 |
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0.28 |
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0.34 |
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High ResolutionContras |
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352 |
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| 5 |
DPR-KT061 |
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1.4 |
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0.28 |
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Wide Process Margin |
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0.35 |
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High ResolutionContrast |
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175 |
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| 6 |
DPR-i7148 |
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1.18 |
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0.28 |
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Wide Process Margin |
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0.35 |
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High ResolutionContrast |
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436 |
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| 7 |
DPR-i7201 |
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1.8 |
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0.35 |
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Multi Purpose(L/SC/H)
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0.50 |
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Photoresist for LCD process
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| Product Name |
Characteristics |
| @DTFR-2000 |
@Normal Grade |
| @DTFR-3750B |
@High Photo Speed High Retention |
| @DTFR-710HP |
@For 4-Mask Process Wide Process Margin |
| @DTFR-5022 series |
@For Large Size Glass High Adhesion |
| @DTFR-6000 series |
@Ultra High Speed, Retention No Mura |
| @DTFR-BK100 |
@Use the Same Developer with C/R
@(KOH 0.04% Sol'n) |
| @DTFR-EL100 |
@For OLED |
| @DTFR-320R |
@For Roll Coater |
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Negative Photoresist for Lift-off OLED Process
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DNR-L300 |
DNR-H100PL |
DNR-1030 |
| @Viscosity |
22`120 |
220 |
30 |
@Film Thickness( ) |
2`10 |
4`12 |
2`5 |
| @Thermal Properties() |
120 |
150 |
250 |
| @Reverse Taper Angel () |
75 |
75 |
65 |
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We offer a full line of deep-UV photoresists for isolated lines, contact holes, dense lines, and trenches. Following is an overview of our products:
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| 1.DHX-LX1000Series |
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DHK-LX1000 series are high resolution & high yield KrF positive type photoresists that corresponds to photofabrication (esp. critical layer) greater than 1G DRAM. |
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Characteristics
- High Resolution
- Superior Defocus Properties
- Wide Process Margin
- High Contrast Properties
- Good Etch Resistance
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| 2.DHK-MX1000Series |
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DHK-MX1000 series are thick KrF positive type photoresists that correspond to photofabrication (esp. metal & implant layer) ranging from 64M DRAM to1G DRAM. |
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Characteristics
- High Aspect Ratio
- Wide Process Margin
- Low ISO-dense Bias
- Rectangular Profile |
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| 3.DHK-CX1100Series |
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DHK-CX1100 series are KrF positive type photoresists that correspond to
photofabrication (esp. contact layer) ranging from 256M to 1G DRAM. |
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Characteristics
- High Contrast
- Steep Profile
- Wide Process Margin
- Superior Depth of Focus |
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| 4.DHA-GX20 |
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DHA-GX20 is a high resolution ArF positive type photoresist that corresponds to photofabrication (esp. Isolate layer) of high speed logic and high resolution memory. |
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Characteristics
- High Resolution
- Wide Process Margin
- High Etch Selectivity
- Low Line Edge Roughness |
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| 3.DHA-H150 |
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DHA-H150 is a high resolution ArF positive type photoresist that corresponds
to photofabrication (esp. Critical Dense L/S layer) ranging from 1G DRAM to 4G DRAM. |
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Characteristics
- High Resolution
- Wide Process Margin
- High Etch Selectivity |
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SEMICONDUCTOR TOPΦ
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